Read the CFI model on the console label before opening. These internal guides target the 2020 Disc Edition (CFI-10xxA).
CFI-11xx, CFI-12xx, Slim CFI-20xx and Pro CFI-70xx have different internal layouts. Do not transfer screw maps or drive procedures between revisions. Sony’s M.2 reference includes separate model instructions.
The processor uses a conductive liquid-metal interface beneath the cooling assembly.
Signs to investigate
- Persistent overheating after external airflow and fan checks
- Damaged cooling hardware
Prepare your bench
- ESD-safe bench
- Liquid-metal service equipment
Diagnose, isolate, then service
- 01
Verify ventilation and fan operation before disturbing the thermal assembly.
- 02
A qualified technician should inspect the heatsink, seals and interface using a revision-matched service procedure.
- 03
If the interface is opened, contain the conductive material and preserve insulation and thermal-pad locations. Do not substitute a generic paste procedure.
Stop before separating the processor interface without suitable training and containment.
Normal temperatures and fan behaviour during a supervised test.
Restore all covers, shielding and cable routing before powered tests. Keep each screw in its original position. If fit or resistance changes, reopen and inspect rather than tightening harder.
Technical reference & evidence
Original notes by VICEPULSE, checked against the reference below. These are concise component notes; use the matched photographic reference for exact fastener locations and connector details. The AI-generated product render is illustrative, not a service drawing.
iFixit original PS5 teardown ↗Source-checked on 31 October 2026. VICEPULSE has not bench-tested this procedure. Internal part fit must be verified against your actual revision.